Title :
3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology
Author :
Tentzeris, Manos M. ; Laskar, Joy ; Papapolymerou, John ; Pinel, Stéphane ; Palazzari, V. ; Li, R. ; DeJean, G. ; Papageorgiou, N. ; Thompson, D. ; Bairavasubramanian, R. ; Sarkar, S. ; Lee, J.-H.
Author_Institution :
Georgia Electron. Design Center, Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
5/1/2004 12:00:00 AM
Abstract :
Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and μBGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2×1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75×35×0.2 mm3) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-integrated RF and mm wave functions and modules.
Keywords :
ball grid arrays; integrated circuit packaging; liquid crystal polymers; millimetre wave antenna arrays; millimetre wave filters; millimetre wave integrated circuits; radiofrequency filters; 14 GHz; 2.4 to 2.5 GHz; 35 GHz; 3D integrated RF functions; 5.15 to 5.85 GHz; LCP substrate; RF modules; WLAN IEEE 802.11a-compliant compact module; dual-band antenna; dual-polarization 2×1 antenna arrays; electronics packaging; embedded functions; front-end modules; high-Q RF inductors; high-Q passives; liquid crystal polymer; micro-BGA technologies; millimeter-wave functions; multilayer modules; multilayer technologies; single-input-single-output dual-band filter; stacking substrates; system-on-package technology; wireless communication applications; Crystalline materials; Electronics packaging; Inductors; Liquid crystal polymers; Millimeter wave communication; Millimeter wave technology; Nonhomogeneous media; Radio frequency; Stacking; Wireless communication; -D; $mu$BGA; Dual-band antenna; LCP; RF and mm-waves front-end module; SOP; dual-band filter; embedded functions; high-Q passives; inductors; integration; liquid crystal polymer; multilayer modules; system-on-package; three-dimensional;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2004.828814
