DocumentCode
1094451
Title
SOP integration and codesign of antennas
Author
Brebels, Steven ; Ryckaert, Julien ; Côme, Boris ; Donnay, Stéphane ; De Raedt, Walter ; Beyne, Eric ; Mertens, Robert P.
Author_Institution
Interuniversity Microelectron. Center, Leuven, Belgium
Volume
27
Issue
2
fYear
2004
fDate
5/1/2004 12:00:00 AM
Firstpage
341
Lastpage
351
Abstract
The successful deployment of wireless systems requires the integration of small, cost-effective antennas while preserving a reasonable electrical performance in the required bandwidth. This paper begins with a short overview of the most important antenna characteristics, and then uses these to describe the minimum requirements and fundamental performance-size limits for electrically small integrated antennas. The performance-size tradeoff is further illustrated by the design of a planar integrated antenna for WLAN. Codesign guidelines are given to avoid parasitic coupling between the integrated antenna and RF circuits. A concluding comparison is made between on-chip and on-package integration of a small antenna for microwave and millimeter wave systems.
Keywords
integrated circuit design; integrated circuit packaging; millimetre wave antennas; radiofrequency integrated circuits; wireless LAN; RF circuits; WLAN; antenna characteristics; codesign guidelines; electrical performance; integrated antennas; microwave systems; millimeter wave systems; on-package integration; parasitic coupling; system-on-package; wireless systems; Antenna feeds; Antenna theory; Bandwidth; Circuits; Costs; Microwave antennas; Microwave frequencies; Millimeter wave technology; Planar arrays; Radio frequency; Antennas; SOP; codesign; integration; system-on-package;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2004.828822
Filename
1331516
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