DocumentCode :
1094697
Title :
A device transfer process "selectively occupied repeated transfer (SORT)" for resource-saving integration of polymer micro optics fabricated by "built-in mask" method
Author :
Yoshimura, Tetsuzo ; Tamaki, Daigo ; Kawamura, Shota ; Arai, Yukihiko ; Asama, Kunihiko
Author_Institution :
Tokyo Univ. of Technol., Japan
Volume :
27
Issue :
3
fYear :
2004
Firstpage :
468
Lastpage :
471
Abstract :
The device transfer process known as selectively occupied repeated transfer, which integrates thin-film device elements into a substrate with desired arrangement at one time using all-photolithographic methods, is demonstrated here. As the elements, 300-μm-diameter polymer waveguide lenses made of acrylic photo-definable material are formed on a poly-vinyl-alcohol (PVA)-coated glass substrate in a two-dimensional array with 450-μm pitch by UV light exposure through a "built-in mask." The lenses are transferred to a supporting substrate by solving the PVA in water, and are further transferred to a final substrate, on which catch-up sites that have stronger adhesion strength than the surrounding area are formed with a pitch of 1800 μm. Selective transfer of the lens to the catch-up site is observed.
Keywords :
adhesive bonding; masks; micro-optics; microassembling; multichip modules; optical waveguides; optoelectronic devices; polymers; substrates; thin film devices; ultraviolet lithography; 300 micron; 450 micron; 800 micron; UV light exposure; acrylic photo-definable material; adhesion strength; all-photolithographic methods; built-in mask method; catch-up sites; device integration; device transfer process; epitaxial liftoff; film optical link multichip-module; optoelectronic micro system integration; optoelectronic multichip-module; photolithographic packaging; poly-vinyl-alcohol-coated glass substrate; polymer micro optics; polymer waveguide lenses; resource-saving integration; selectively occupied repeated transfer; supporting substrate; thin-film device elements; Glass; Integrated optics; Lenses; Optical devices; Optical materials; Optical polymers; Optical waveguides; Polymer films; Substrates; Thin film devices; Built-in mask method; FOLM; PL-Pack; SORT; device integration; device transfer; epitaxial liftoff; film optical link multichip-module; micro optics; optoelectronic micro system integration; optoelectronic multichip-module; photolithographic packaging; resource saving; selectively occupied repeated transfer;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.831771
Filename :
1331541
Link To Document :
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