DocumentCode :
1094858
Title :
Mechanics-based solutions to RF MEMS switch stiction problem
Author :
Mercado, Lei L. ; Kuo, Shun-Meen ; Lee, Tien-Yu Tom ; Liu, Lianjun
Author_Institution :
Medtronic, Minneapolis, MN, USA
Volume :
27
Issue :
3
fYear :
2004
Firstpage :
560
Lastpage :
567
Abstract :
RF micro-electro-mechanical systems (MEMS) switches are an attractive solution to switch antenna bands and transmit/receive switching for future multiband, high bandwidth cell phones. However, Stiction is a major concern for resistive switches with metal-to-metal contact. An iterative-coupled electrostatic-structural analysis is utilized to evaluate the effect of design parameters on restoring force of MEMS switches. Parameters including metal thickness, dielectric thickness, beam-to-ground gap height, metal and dielectric width, and cantilever beam length can be evaluated. The electrostatic force is first calculated based on the electrical field component. A structural analysis is then performed to determine the cantilever beam deflection due to the electrostatic force. A unique integrated empirical-numerical method is used to quantitatively determine the stiction force based on measured actuation voltages for real devices. The analysis can provide quick evaluation and screenings of proposed designs to determine if their actuation voltage falls in the acceptable range. Simulation prediction agrees very well with test measurements. Although increasing cantilever thickness and shortening cantilever length both increase restoring force, the actuation voltage will increase significantly as a result. The most favorable modification is to increase the electrode area. A short and wide structure with a large area can increase restoring force while maintaining low actuation voltage. Compared to similar bi-layer designs, sandwich designs can be actuated at further reduced voltages without changing the beam restoring force. In addition, the sandwich structure, being thermal-stress-balanced, is less sensitive to temperature excursion. With the properly selected design parameters, the new designs will be able to achieve the break away restoring force of the original design at much lower actuation voltages. Switches with good electrical as well as mechanical performances have been successfully fabricated.
Keywords :
electrostatic devices; microswitches; reliability; stiction; RF microelectromechanical systems switches; actuation voltages measurement; antenna bands switching; antistiction; beam restoring force; beam-to-ground gap height; bi-layer designs; cantilever beam deflection; cantilever beam length; cantilever length; cantilever thickness; design optimization; design parameters; dielectric thickness; dielectric width; electrical field component; electrical performance; electrode area; electrostatic force; finite element modeling; high bandwidth cell phones; integrated empirical-numerical method; iterative coupled analysis; iterative-coupled electrostatic-structural analysis; mechanical performances; mechanics-based solutions; metal thickness; metal width; metal-to-metal contact; multiband cell phones; reliability; resistive switches; sandwich designs; stiction force; structural analysis; switch stiction problem; temperature excursion; test measurements; thermal-stress-balanced; transmit-receive switching; Dielectrics; Electrostatic analysis; Force measurement; Micromechanical devices; Radiofrequency microelectromechanical systems; Receiving antennas; Structural beams; Switches; Transmitting antennas; Voltage; Actuation voltage; FEM; RF MEMS; antistiction; design optimization; finite element modeling; iterative coupled analysis; mechanical performance; reliability; restoring force; sandwich designs; stiction; switch;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.831813
Filename :
1331553
Link To Document :
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