Title :
Arrhenius average temperature: the effective temperature for non-fatigue wearout and long term reliability in variable thermal conditions and climates
Author :
Tencer, Michal ; Moss, John Seaborn ; Zapach, Trevor
Author_Institution :
Nortel Networks, Ottawa, Ont., Canada
Abstract :
This paper presents a method of assessing the effective temperature essential for predicting the temperature acceleration of the wearout mechanisms (other than thermal fatigue) of electronic equipment. This is particularly important for equipment experiencing variable thermal conditions. The approach, based on weighting of thermal acceleration factors, leads to the Arrhenius average temperature Teff given by (4). Teff is related to wearout processes and allows one to compare predictions from the thermal design to results of accelerated testing. It has no relation to the maximum component temperature which influences functionality. The method is applicable to outside plant telecommunication equipment as well as in the automotive and aerospace industries. The effect of climate and design constraints on Teff are discussed.
Keywords :
electronic equipment testing; electronics packaging; environmental factors; reliability; temperature measurement; thermal management (packaging); Arrhenius average temperature; accelerated testing; aerospace industry; automotive industry; climate condition; effective temperature; electronic equipment; nonfatigue wearout; plant telecommunication equipment; reliability; temperature acceleration; thermal acceleration factors; thermal condition; thermal design; thermal fatigue; wearout mechanisms; Acceleration; Aerospace industry; Automotive engineering; Electronic equipment; Failure analysis; Fatigue; Helium; Life estimation; Temperature dependence; Thermal factors; Arrhenius average temperature; thermal acceleration factors; thermal fatigue;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2004.831834