• DocumentCode
    1094952
  • Title

    How China is closing the semiconductor technology gap

  • Author

    Pecht, Michael G.

  • Author_Institution
    Mech. Eng. Dept., Univ. of Maryland, College Park, MD, USA
  • Volume
    27
  • Issue
    3
  • fYear
    2004
  • Firstpage
    616
  • Lastpage
    619
  • Abstract
    China has been obtaining and advancing technology in a manner and at a pace that has surprised most people. The high-tech semiconductor industry exemplifies this growth. In less than 10 years China went from being five generations behind in integrated circuit (IC) semiconductor processing, to being current with the state-of-the-art. With the help of Chinese engineers, often educated by U.S. companies including Motorola and Intel, Chinese companies will soon be producing the leading IC technologies for the world. With the already existing infrastructure to incorporate semiconductors into advanced systems, and a large internal (and external) market, China´s future truly looks bright.
  • Keywords
    consumer products; integrated circuit manufacture; integrated circuit technology; semiconductor device manufacture; semiconductor technology; technological forecasting; technology transfer; China; Intel; Motorola; US companies; consumer product manufacturing; integrated circuit semiconductor processing; semiconductor industry; semiconductor technology; Aerospace electronics; Consumer electronics; Costs; Electronics industry; Integrated circuit technology; Military aircraft; Printers; Research and development; Semiconductor device manufacture; Semiconductor lasers; China; R&D; export policy; semiconductor;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.834952
  • Filename
    1331560