DocumentCode
1094952
Title
How China is closing the semiconductor technology gap
Author
Pecht, Michael G.
Author_Institution
Mech. Eng. Dept., Univ. of Maryland, College Park, MD, USA
Volume
27
Issue
3
fYear
2004
Firstpage
616
Lastpage
619
Abstract
China has been obtaining and advancing technology in a manner and at a pace that has surprised most people. The high-tech semiconductor industry exemplifies this growth. In less than 10 years China went from being five generations behind in integrated circuit (IC) semiconductor processing, to being current with the state-of-the-art. With the help of Chinese engineers, often educated by U.S. companies including Motorola and Intel, Chinese companies will soon be producing the leading IC technologies for the world. With the already existing infrastructure to incorporate semiconductors into advanced systems, and a large internal (and external) market, China´s future truly looks bright.
Keywords
consumer products; integrated circuit manufacture; integrated circuit technology; semiconductor device manufacture; semiconductor technology; technological forecasting; technology transfer; China; Intel; Motorola; US companies; consumer product manufacturing; integrated circuit semiconductor processing; semiconductor industry; semiconductor technology; Aerospace electronics; Consumer electronics; Costs; Electronics industry; Integrated circuit technology; Military aircraft; Printers; Research and development; Semiconductor device manufacture; Semiconductor lasers; China; R&D; export policy; semiconductor;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2004.834952
Filename
1331560
Link To Document