• DocumentCode
    1095086
  • Title

    Case study of a printed-wire-board concerning (Re-)Design for environment

  • Author

    Brandstötter, M. ; Knoth, R. ; Kopacek, Bernd ; Kopacek, Peter

  • Author_Institution
    Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
  • Volume
    27
  • Issue
    1
  • fYear
    2004
  • Firstpage
    26
  • Lastpage
    32
  • Abstract
    Nowadays, printed-wire-boards (PWB) appear in nearly every electronic appliance. The fast pace of technological innovation and the consequent shortening of the product lifetime lead to a rapidly growing waste stream of electronic products. Therefore, solutions regarding the end-of-life are urgently required. Our goal is to extend the lifetime of electronic products in order to decrease the environmental impact. Therefore, this case study focused on designing PWBs for maximum component reusability and for a better separation of hazardous components. The project became possible by building a flexible semiautomatic disassembling cell "Σ! 1592-Disassembly Factory" within the strategic CARE initiative for extracting valuable components from PWBs. Finally, design guidelines are going to be presented that address the layout of PWBs, important properties of components and integrated circuits (ICs), connection technologies, and others. The intention of this paper is to close the loop among the actors of the product lifecycle and particularly between recycling companies and manufacturers. The checklist will help product designers to identify the most important aspects in terms of reusability and environmentally conscious design of PWBs.
  • Keywords
    design for disassembly; design for environment; printed circuit design; recycling; component reusability; design-for-environment; design-for-reusability; end-of-life; integrated circuits; printed-wire-board; product design; product lifecycle; product lifetime extension; Buildings; Guidelines; Home appliances; Integrated circuit layout; Integrated circuit technology; Product design; Production facilities; Pulp manufacturing; Recycling; Technological innovation; DFE of printed-wire-boards; Design for reusability; PWBs; lifetime extension;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2004.830506
  • Filename
    1331572