• DocumentCode
    1095135
  • Title

    A "defect level versus cost" system tradeoff for electronics manufacturing

  • Author

    Scheffler, Michael ; Franzon, Paul D. ; Tröster, Gerhard

  • Author_Institution
    Art of Technol., Zurich, Switzerland
  • Volume
    27
  • Issue
    1
  • fYear
    2004
  • Firstpage
    67
  • Lastpage
    76
  • Abstract
    Both cost and quality are important features when manufacturing today´s high-performance electronics. Unfortunately, the two design goals (low) cost and (high) quality are somewhat mutually exclusive. High testing effort (and thus, quality) comes with a considerable cost, and lowering test activities has significant impact on the delivered quality. In this paper, we present a new structured search method to obtain the best combination of these two goals. It features a Petri-net oriented cost/quality modeling approach and uses a Pareto chart to visualize the results. The search for the Pareto-optimal points is done by means of a genetic algorithm. With our method, we optimize a manufacturing process for a global positioning system (GPS) front end. The optimized process clearly outperformed the standard fabrication process.
  • Keywords
    Global Positioning System; Petri nets; electronic equipment manufacture; genetic algorithms; packaging; Pareto chart; Pareto-optimal points; Petri-net oriented cost; cost quality tradeoff; defect level versus cost system; design goals; electronics manufacturing; fabrication process; genetic algorithm; global positioning system; high-density packaging; high-performance electronics; manufacturing process; quality modeling; search method; test activities; Built-in self-test; Circuit faults; Cost function; Electronics packaging; Fabrication; Genetic algorithms; Manufacturing processes; Search methods; Testing; Visualization; Cost quality tradeoff; HDP; Pareto chart; genetic algorithm; high-density packaging;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2004.830513
  • Filename
    1331577