• DocumentCode
    1095970
  • Title

    Photolithographic Process for Integration of the Biopolymer Chitosan Into Micro/Nanostructures

  • Author

    Cheng, Jim C. ; Pisano, Albert P.

  • Author_Institution
    Univ. of California at Berkeley, Berkeley
  • Volume
    17
  • Issue
    2
  • fYear
    2008
  • fDate
    4/1/2008 12:00:00 AM
  • Firstpage
    402
  • Lastpage
    409
  • Abstract
    This paper describes a novel photolithographic method to fabricate MEMS structures from chitosan, which is a beta-1,4-linked polysaccharide. The biopolymer chitosan is the partially deacetylated product of chitin. Chitin is used in nature as robust bioscaffolds and infrared absorbers. Chitosan has been shown to have similar properties and may additionally form cationic hydrogels. Patterning methods for chitosan in the literature include imprinting, electrodeposition, and mold-casting. These methods have numerous substrate and surface topography limitations and occur in aqueous solutions, which for most hydrogels, are when they are most susceptible to chemical changes. In order to surmount these obstacles, the authors have adopted low-temperature photolithography for the chitosan that uses the following: 1) a polymethyl-methacrylate chemical barrier layer and 2) a dry anisotropic oxygen plasma etch for direct transfer of features-as small as 1 mum.
  • Keywords
    micromechanical devices; nanotechnology; photolithography; polymers; 4-linked polysaccharide; MEMS structures; biopolymer chitosan; bioscaffolds; dry anisotropic oxygen plasma etch; electrodeposition; imprinting; infrared absorbers; low-temperature photolithography; microstructures; mold casting; nanostructures; patterning methods; photolithographic process; polymethyl-methacrylate chemical barrier layer; substrate; surface topography; Biological materials; biomedical materials; biopolymers; chitosan; photolithography; polysaccharides; semiconductor device fabrication; thin films;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2008.916325
  • Filename
    4469666