DocumentCode
1095970
Title
Photolithographic Process for Integration of the Biopolymer Chitosan Into Micro/Nanostructures
Author
Cheng, Jim C. ; Pisano, Albert P.
Author_Institution
Univ. of California at Berkeley, Berkeley
Volume
17
Issue
2
fYear
2008
fDate
4/1/2008 12:00:00 AM
Firstpage
402
Lastpage
409
Abstract
This paper describes a novel photolithographic method to fabricate MEMS structures from chitosan, which is a beta-1,4-linked polysaccharide. The biopolymer chitosan is the partially deacetylated product of chitin. Chitin is used in nature as robust bioscaffolds and infrared absorbers. Chitosan has been shown to have similar properties and may additionally form cationic hydrogels. Patterning methods for chitosan in the literature include imprinting, electrodeposition, and mold-casting. These methods have numerous substrate and surface topography limitations and occur in aqueous solutions, which for most hydrogels, are when they are most susceptible to chemical changes. In order to surmount these obstacles, the authors have adopted low-temperature photolithography for the chitosan that uses the following: 1) a polymethyl-methacrylate chemical barrier layer and 2) a dry anisotropic oxygen plasma etch for direct transfer of features-as small as 1 mum.
Keywords
micromechanical devices; nanotechnology; photolithography; polymers; 4-linked polysaccharide; MEMS structures; biopolymer chitosan; bioscaffolds; dry anisotropic oxygen plasma etch; electrodeposition; imprinting; infrared absorbers; low-temperature photolithography; microstructures; mold casting; nanostructures; patterning methods; photolithographic process; polymethyl-methacrylate chemical barrier layer; substrate; surface topography; Biological materials; biomedical materials; biopolymers; chitosan; photolithography; polysaccharides; semiconductor device fabrication; thin films;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2008.916325
Filename
4469666
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