DocumentCode :
1096073
Title :
Imaging of Local Stiffness of Damaged Polycrystalline Copper: Nondestructive Evaluation by Resonance Ultrasound Microscopy
Author :
Ogi, Hirotsugu ; Hayama, Noritaka ; Niho, Hiroki ; Hirao, Masahiko ; Morishita, Tomohiro
Author_Institution :
Osaka Univ., Osaka
Volume :
54
Issue :
8
fYear :
2007
fDate :
8/1/2007 12:00:00 AM
Firstpage :
1514
Lastpage :
1520
Abstract :
The distribution of the local stiffness of a polycrystalline copper exposed to a creep test was studied by resonance ultrasound microscopy. The local effective modulus was evaluated from the resonance frequency of the isolated langasite oscillator touching the specimen. Defects appeared predominantly on grain boundaries, and they were clearly visualized by the stiffness microscopy through the significant decrease of the effective stiffness. The stiffness within the grains becomes lower regardless of invisible defects. The stiffness distribution was quantitatively analyzed by the contact model between two anisotropic bodies and by the micromechanics modeling. The microscopic stiffness shows much higher sensitivity to the defects than the macroscopic stiffness.
Keywords :
acoustic resonance; copper; creep; elastic constants; grain boundaries; micromechanics; ultrasonic materials testing; Cu - Element; anisotropic bodies; contact model; creep; damaged polycrystalline copper; grain boundaries; isolated langasite oscillator resonance frequency; local stiffness distribution; micromechanics modeling; nondestructive evaluation; resonance ultrasound microscopy; stiffness microscopy; Copper; Creep; Grain boundaries; Local oscillators; Microscopy; Resonance; Resonant frequency; Testing; Ultrasonic imaging; Visualization;
fLanguage :
English
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/TUFFC.2007.421
Filename :
4291500
Link To Document :
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