Title :
Imaging of Local Stiffness of Damaged Polycrystalline Copper: Nondestructive Evaluation by Resonance Ultrasound Microscopy
Author :
Ogi, Hirotsugu ; Hayama, Noritaka ; Niho, Hiroki ; Hirao, Masahiko ; Morishita, Tomohiro
Author_Institution :
Osaka Univ., Osaka
fDate :
8/1/2007 12:00:00 AM
Abstract :
The distribution of the local stiffness of a polycrystalline copper exposed to a creep test was studied by resonance ultrasound microscopy. The local effective modulus was evaluated from the resonance frequency of the isolated langasite oscillator touching the specimen. Defects appeared predominantly on grain boundaries, and they were clearly visualized by the stiffness microscopy through the significant decrease of the effective stiffness. The stiffness within the grains becomes lower regardless of invisible defects. The stiffness distribution was quantitatively analyzed by the contact model between two anisotropic bodies and by the micromechanics modeling. The microscopic stiffness shows much higher sensitivity to the defects than the macroscopic stiffness.
Keywords :
acoustic resonance; copper; creep; elastic constants; grain boundaries; micromechanics; ultrasonic materials testing; Cu - Element; anisotropic bodies; contact model; creep; damaged polycrystalline copper; grain boundaries; isolated langasite oscillator resonance frequency; local stiffness distribution; micromechanics modeling; nondestructive evaluation; resonance ultrasound microscopy; stiffness microscopy; Copper; Creep; Grain boundaries; Local oscillators; Microscopy; Resonance; Resonant frequency; Testing; Ultrasonic imaging; Visualization;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2007.421