DocumentCode
1097145
Title
Realization of Ultra Fine Pitch Traces on LCP Substrates
Author
Dean, Robert Neal, Jr. ; Weller, Jennifer ; Bozack, Mike J M J ; Rodekohr, Chad L. ; Farrell, Brian ; Jauniskis, Linas ; Ting, Joseph ; Edell, David J. ; Hetke, Jamille F.
Author_Institution
Auburn Univ., Auburn, AL
Volume
31
Issue
2
fYear
2008
fDate
6/1/2008 12:00:00 AM
Firstpage
315
Lastpage
321
Abstract
Liquid crystal polymer (LCP) is being utilized in a variety of applications that could benefit from the realization of ultra fine pitch conductive traces on the surface of the LCP substrate. LCP has unique chemical properties that not only benefit the intended application, but can also be exploited to realize ultra fine pitch traces. Through a series of experiments, it was discovered that a thin film of Ti can form TiC with the surface of an Ar ion ablated LCP substrate. This layer then provides sufficient adhesion for other metals to be deposited so that ultra fine pitch traces can be patterned. Using this process, 10 mum wide traces on a 20 mum pitch with high yield were demonstrated and analyzed. Smaller feature size test structures were also demonstrated.
Keywords
electronics packaging; fine-pitch technology; liquid crystal polymers; substrates; LCP substrates; chemical properties; electronics packaging; liquid crystal polymer; thin film; ultra fine pitch conductive traces; Liquid crystal polymer (LCP); packaging; ultra fine pitch;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.916790
Filename
4469968
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