DocumentCode :
1097618
Title :
Trench-isolated transistors in lateral CVD epitaxial silicon-on-insulator films
Author :
Kamins, T.I. ; Bradbury, D.R.
Author_Institution :
Hewlett-Packard Laboratories, Palo Alto, CA
Volume :
5
Issue :
11
fYear :
1984
fDate :
11/1/1984 12:00:00 AM
Firstpage :
449
Lastpage :
451
Abstract :
Completely dielectrically isolated, p-channel MOS transistors have been obtained by lateral chemical vapor deposition (CVD) epitaxial overgrowth of buried oxide layers and subsequent lateral isolation with refilled trenches. The transistor characteristics are similar to those in bulk control wafers. Isolation between the device island and the substrate is approximately 1012Ω.
Keywords :
Chemical vapor deposition; Dielectric films; Dielectric substrates; Integrated circuit technology; Integrated circuit yield; Isolation technology; Semiconductor films; Silicon compounds; Silicon on insulator technology; Temperature;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1984.25983
Filename :
1484359
Link To Document :
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