DocumentCode
1097618
Title
Trench-isolated transistors in lateral CVD epitaxial silicon-on-insulator films
Author
Kamins, T.I. ; Bradbury, D.R.
Author_Institution
Hewlett-Packard Laboratories, Palo Alto, CA
Volume
5
Issue
11
fYear
1984
fDate
11/1/1984 12:00:00 AM
Firstpage
449
Lastpage
451
Abstract
Completely dielectrically isolated, p-channel MOS transistors have been obtained by lateral chemical vapor deposition (CVD) epitaxial overgrowth of buried oxide layers and subsequent lateral isolation with refilled trenches. The transistor characteristics are similar to those in bulk control wafers. Isolation between the device island and the substrate is approximately 1012Ω.
Keywords
Chemical vapor deposition; Dielectric films; Dielectric substrates; Integrated circuit technology; Integrated circuit yield; Isolation technology; Semiconductor films; Silicon compounds; Silicon on insulator technology; Temperature;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1984.25983
Filename
1484359
Link To Document