DocumentCode :
1097678
Title :
Merged CMOS/bipolar technologies utilizing zone-melting-recrystallized SOI films
Author :
Tsaur, B-Y. ; Mountain, R.W. ; Chen, C.K. ; Fan, J.C.C.
Author_Institution :
Massachusetts Institute of Technology, Lexington, MA
Volume :
5
Issue :
11
fYear :
1984
fDate :
11/1/1984 12:00:00 AM
Firstpage :
461
Lastpage :
463
Abstract :
Two merged CMOS/bipolar technologies utilizing SOI structures have been demonstrated. In each case a single sequence of processing steps was used to fabricate fully isolated CMOS devices and vertical bipolar transistors on the same Si wafer. The CMOS devices were fabricated in zone-melting-recrystallized SOI film, while the bipolar devices were fabricated either in the SOI film or in epitaxial Si layers grown selectively on the Si substrate. Good electrical characteristics were obtained for the CMOS devices and for both SOI and epitaxial bipolar devices.
Keywords :
Bipolar transistors; CMOS digital integrated circuits; CMOS process; CMOS technology; Epitaxial layers; Etching; Ion implantation; Isolation technology; Semiconductor films; Substrates;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1984.25988
Filename :
1484364
Link To Document :
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