• DocumentCode
    1098420
  • Title

    Filtered vacuum arc deposition of semiconductor thin films

  • Author

    Boxman, Raymond L. ; Goldsmith, Samuel ; Ben-Shalom, Amir ; Kaplan, Larissa ; Arbilly, David ; Gidalevich, Evgeny ; Zhitomirsky, Vladimir ; Ishaya, Amiel ; Keidar, Michael ; Beilis, Isak I.

  • Author_Institution
    Electr. Discharge & Plasma Lab., Tel Aviv Univ., Israel
  • Volume
    23
  • Issue
    6
  • fYear
    1995
  • fDate
    12/1/1995 12:00:00 AM
  • Firstpage
    939
  • Lastpage
    944
  • Abstract
    The cathode spot vacuum arc produces a jet of highly ionized plasma plus a spray of liquid droplets, both consisting of cathode material. The droplets are filtered from the plasma by passing the plasma through a curved, magnetized duct. A radial magnetic field may be applied to the face of the cathode to rotate and distribute the cathode spots in order to obtain even erosion and avoid local overheating. The choice of axial magnetic field strength in the vicinity of the cathode is a compromise between a relatively high field desired to collimate a large fraction of the plasma flux, and the need to collect a substantial fraction of the plasma at the anode in order to reduce arc voltage and insure arc stability. The transmission of the filter duct increases with magnetic field strength until a saturation value is reached. Entrainment of the droplets in the plasma jet can decrease the effectiveness of the filter at high plasma flux. Semiconducting thin films of amorphous silicon were prepared using cathodes of heavily B-doped Si. Arcs of 35-A current produced a deposition rate of 10 Å/s. The electrical conductivity of the films was similar to conventional a-Si:H films deposited by conventional Silane based PACVD at high temperatures, but had a higher room-temperature conductivity. Transparent conducting films of Sn-O were deposited at rates of up to 100 Å/s using 160-A arcs on a Sn cathode while injecting O2 gas in the vicinity of the substrate. Adjustment of the O content is critical for optimizing conductivity, and complicated by pumping effects of the arc. Optimal conductivity was achieved at an oxygen pressure of 6 mtorr. Conductivities equal to the best reported to date were achieved by subjecting the room-temperature deposited films to a 30-s rapid thermal annealing at 350°C. Both the deposited and annealed films are amorphous. The deposition rates achieved by the filtered vacuum arc technique for these semiconductor films are an order of magnitude greater than achieved with conventional methods, while the conductivities are equivalent or better
  • Keywords
    amorphous semiconductors; arcs (electric); boron; cathodes; drops; elemental semiconductors; plasma CVD; plasma jets; plasma transport processes; semiconductor thin films; silicon; tin compounds; vacuum arcs; 160 A; 30 s; 35 A; 350 C; O2; Si:B; Si:H; SiH4; Sn; Sn-O; a-Si:H films; annealed fims; cathode spot vacuum arc; cathode spots; deposited films; deposition rate; deposition rates; electrical conductivity; entrainment; erosion; filter duct; filtered vacuum arc deposition; highly ionized plasma; jet; liquid droplets; local overheating; optimal conductivity; plasma flux; radial magnetic field; room-temperature deposited films; semiconductor thin films; spray; Cathodes; Conductive films; Conductivity; Magnetic fields; Magnetic separation; Plasma materials processing; Plasma stability; Semiconductor films; Semiconductor thin films; Vacuum arcs;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.476479
  • Filename
    476479