DocumentCode :
1098656
Title :
Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network
Author :
Oo, Zaw Zaw ; Li, Er-Ping ; Wei, Xing-Chang ; Liu, En-Xiao ; Zhang, Yao-Jiang ; Li, Le-Wei Joshua
Author_Institution :
Dept. of Electromagn. & Electron. Syst., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore
Volume :
51
Issue :
3
fYear :
2009
Firstpage :
784
Lastpage :
791
Abstract :
A hybrid scattering matrix method (SMM) and a modal decomposition technique for analysis of signal traces in the power distribution network of an electronic package are presented in this paper. Applying the modal decomposition of the waves propagating inside the power-ground (P-G) planes and the signal traces, the electromagnetic fields can be decomposed into the parallel-plate mode and the transmission-line mode. The former is analyzed by using the SMM for the finite P-G planes with multiple vias. The multiconductor transmission-line theory is applied to model the micro-stripline and stripline in the package. Numerical simulations are illustrated for coupling analysis of P-G vias to the signal traces in the package and examined through experimental and numerical validations.
Keywords :
S-matrix theory; distribution networks; electromagnetic wave propagation; microstrip lines; numerical analysis; transmission line theory; electromagnetic wave propagation; electronic package; hybrid scattering matrix; microstrip line; modal decomposition; multiconductor transmission line theory; numerical simulations; power distribution network; signal trace analysis; Electromagnetic fields; Electromagnetic propagation; Electromagnetic scattering; Electronics packaging; Matrix decomposition; Power systems; Signal analysis; Stripline; Transmission line matrix methods; Transmission lines; Electronic package; modal decomposition method; power distribution network (PDN); power integrity; signal traces; through-hole vias;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2009.2022543
Filename :
5109642
Link To Document :
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