Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems

Author

Chen, Morgan Jikang ; Pham, Anh-Vu ; Evers, Nicole ; Kapusta, Chris ; Iannotti, Joseph ; Kornrumpf, William ; Maciel, John

Author_Institution

Endwave Corp., San Jose

Volume

56

Issue

4

fYear

2008

fDate

4/1/2008 12:00:00 AM

Firstpage

952

Lastpage

958

Abstract

We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package, we have designed and implemented a 2-bit true-time delay X-band phase shifter using commercially available microelectromechanical switches. The packaged phase shifter has a measured insertion loss of 2.45 plusmn 0.12 dB/bit at 10 GHz. The worst case phase variation of the phase shifter at 10 GHz is measured to less than 5deg. We have also conducted temperature cycling (-65degC to 150degC) and 85/85 to qualify the packaging structures.

Keywords

chip scale packaging; liquid crystal polymers; microswitches; organic semiconductors; phase shifters; polymer films; RF microelectromechanical systems; hermetic cavities; liquid-crystal polymer film; microelectromechanical switches; multilayer organic multichip module; organic package design; organic thin-film polyimide; true-time delay X-band phase shifter; Cavities; chip-on-flex; liquid-crystal polymer (LCP); microelectromechanical systems (MEMS); microwave; packaging; phase shifter;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2008.919642

Filename

4470584