DocumentCode :
1099760
Title :
Al/Si contact resistance for submicrometer design rules
Author :
Ford, Jenny M.
Author_Institution :
Motorola Semiconductor Research and Development Laboratory, Phoenix, AZ
Volume :
32
Issue :
4
fYear :
1985
fDate :
4/1/1985 12:00:00 AM
Firstpage :
840
Lastpage :
842
Abstract :
The resistance of contacts between aluminum/1.5-percent silicon and doped silicon is experimentally determined as a function of contact sizes from 0.6 to 4 µm square. Silicon contacted was doped to varied concentrations with either boron or phosphorus. The magnitudes of resistances observed for submicrometer geometry contacts underscore the need for a lower resistance-contact process for high-performance VLSI.
Keywords :
Analytical models; Contact resistance; Electrical resistance measurement; Electron devices; Geometry; Kelvin; Semiconductor process modeling; Silicon; Two dimensional displays; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1985.22030
Filename :
1484776
Link To Document :
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