DocumentCode :
1100408
Title :
Fabrication of fully self-aligned joint-gate CMOS structures
Author :
Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.
Author_Institution :
General Electric Company, Schenectady, NY
Volume :
32
Issue :
6
fYear :
1985
fDate :
6/1/1985 12:00:00 AM
Firstpage :
1140
Lastpage :
1142
Abstract :
A six-mask process that yields stacked CMOS structures with the source and drain of both transistors self-aligned to a joint-gate electrode has been developed. The features that permit full self-alignment are an edge-defined silicon nitride "filament," used as an oxidation mask, and overlapping polysilicon "handles," used to form the top transistor source and drain regions. The individual NMOS and PMOS transistors have been characterized and together are functional in joint-gate CMOS inverters.
Keywords :
CMOS process; CMOS technology; Capacitance; Circuits; Computer science; Electrodes; Fabrication; Nonhomogeneous media; Oxidation; Silicon;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1985.22087
Filename :
1484833
Link To Document :
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