Title :
Fabrication of fully self-aligned joint-gate CMOS structures
Author :
Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.
Author_Institution :
General Electric Company, Schenectady, NY
fDate :
6/1/1985 12:00:00 AM
Abstract :
A six-mask process that yields stacked CMOS structures with the source and drain of both transistors self-aligned to a joint-gate electrode has been developed. The features that permit full self-alignment are an edge-defined silicon nitride "filament," used as an oxidation mask, and overlapping polysilicon "handles," used to form the top transistor source and drain regions. The individual NMOS and PMOS transistors have been characterized and together are functional in joint-gate CMOS inverters.
Keywords :
CMOS process; CMOS technology; Capacitance; Circuits; Computer science; Electrodes; Fabrication; Nonhomogeneous media; Oxidation; Silicon;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1985.22087