Title :
Flexible Self-Aligned Double-Gate IGZO TFT
Author :
Munzenrieder, N. ; Voser, Pascal ; Petti, L. ; Zysset, Christoph ; Buthe, L. ; Vogt, Christian ; Salvatore, G.A. ; Troster, G.
Author_Institution :
Inst. for Electron., Swiss Fed. Inst. of Technol. Zurich, Zürich, Switzerland
Abstract :
In this letter, flexible double-gate (DG) thin-film transistors (TFTs) based on InGaZnO4 and fabricated on free standing plastic foil, using self-alignment (SA) are presented. The usage of transparent indium-tin-oxide instead of opaque metals enables SA of source-, drain-, and top-gate contacts. Hence, all layers, which can cause parasitic capacitances, are structured by SA. Compared with bottom-gate reference TFTs fabricated on the same substrate, DG TFTs exhibit a by 68% increased transconductance and a subthreshold swing as low as 109 mV/dec decade (-37%). The clockwise hysteresis of the DG TFTs is as small as 5 mV. Because of SA, the source/drain to gate overlaps are as small as ≈ 1 μm leading to parasitic overlap capacitances of 5.5 fF μm-1. Therefore a transit frequency of 5.6 MHz is measured on 7.5 μm long transistors. In addition, the flexible devices stay fully operational when bent to a tensile radius of 6 mm.
Keywords :
II-VI semiconductors; flexible electronics; gallium compounds; indium compounds; thin film transistors; titanium compounds; wide band gap semiconductors; zinc compounds; DG thin-film transistors; InGaZnO4; InTiO; SA; bottom-gate reference TFTs; clockwise hysteresis; drain contacts; flexible devices; flexible self-aligned double-gate IGZO TFT; free standing plastic foil; frequency 5.6 MHz; opaque metals; parasitic capacitances; radius 6 mm; self-alignment; size 7.5 mum; source contacts; subthreshold swing; top-gate contacts; transconductance; transparent indium-tin-oxide; Frequency measurement; Logic gates; Performance evaluation; Resists; Substrates; Thin film transistors; Double-gate (DG); flexible electronics; indium-gallium-zinc-oxide (IGZO); self-alignment (SA); thin-film transistor (TFT);
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2013.2286319