DocumentCode :
1101998
Title :
Glowing contact areas in loose copper wire connections
Author :
Sletbak, Jarle ; Kristensen, Roar ; Sundklakk, Håkon ; Nåvik, Gunnar ; Runde, Magne
Author_Institution :
Norwegian Inst. of Technol., Trondheim, Norway
Volume :
15
Issue :
3
fYear :
1992
fDate :
6/1/1992 12:00:00 AM
Firstpage :
322
Lastpage :
327
Abstract :
Laboratory experiments are reported that show that when a current-carrying loose copper wire connection is exposed to mechanical vibrations, a layer of Cu2O grows to form a bridge between the contact members, bonding them to one another. Due to the strongly negative temperature coefficient of Cu2O at high temperatures, the current is concentrated in a thin, glowing filament at or near the surface of the oxide bridge. The maximum temperature of this filament was found to be 1200-1300°C. Under the action of this hot filament, a rapid oxidation of the copper continues until most of the circumference of the copper wires is converted to Cu2O to a depth of a few tenths of a millimeter. As the corrosion proceeds, the power dissipation increases to values that can cause fire hazards. The phenomenon described explains how a temperature high enough to initiate a fire can arise, even when the current through the connection is limited by the load impedance to values less than 1 A
Keywords :
building wiring; copper; copper compounds; corrosion; electrical contacts; fires; oxidation; safety; vibrations; wear; 1 A; 1200 to 1300 C; Cu wires; Cu-Cu2O-Cu; corrosion; fire hazards; fire initiation; fire risk; glowing contact areas; glowing filament; high temperatures; hot filament; laboratory experiments; loose Cu wire connections; maximum temperature; mechanical vibrations; negative temperature coefficient; oxide bridge; power dissipation; rapid oxidation; Bonding; Bridges; Copper; Corrosion; Fires; Laboratories; Oxidation; Temperature; Vibrations; Wire;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.148498
Filename :
148498
Link To Document :
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