Title :
Nonplanar InGaAs Gate Wrapped Around Field-Effect Transistors
Author :
Fei Xue ; Aiting Jiang ; Yen-Ting Chen ; Yanzhen Wang ; Fei Zhou ; Yao-Feng Chang ; Lee, Jeyull
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Texas at Austin, Austin, TX, USA
Abstract :
Nonplanar In0.53Ga0.47As gate wrap around field-effect transistors (GWAFETs) with atomic-layer deposited high-k dielectric and metal gate have been demonstrated in this paper. By applying novel device structure and optimizing fabrication process, In0.53Ga0.47As GWAFETs exhibit significant performance improvements over planar MOSFETs on both current drive capability and electrostatics control. In0.53Ga0.47As GWAFETs with fin width (Wfin) 40-200 nm have been fabricated. Devices with narrower Wfin exhibit higher drive current, transconductance, and better short channel effect control, which demonstrates the scalability of nonplanar In0.53Ga0.47As GWAFETs. Subthreshold swing of 80 mV/decade and drain-induced barrier lowering of 20 mV/V have been achieved by 40-nm Wfin and 140-nm Lg In0.53Ga0.47As GWAFETs.
Keywords :
III-V semiconductors; MOSFET; atomic layer deposition; gallium arsenide; high-k dielectric thin films; indium compounds; GWAFET; InGaAs; atomic layer deposition; fabrication process optimisation; gate wrap around field effect transistors; high-k dielectric; metal gate; nonplanar gate wrapped around FET; size 40 nm to 200 nm; Aluminum oxide; Contact resistance; High K dielectric materials; Indium gallium arsenide; Indium phosphide; Logic gates; MOSFET; Gate wrapped around (GWA); InGaAs; MOSFETs; nanowire; nonplanar; scalability; scalability.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2320946