• DocumentCode
    1102896
  • Title

    Wear and contamination of electroplated gold films in line contact

  • Author

    Chen, Zhuan-Ke

  • Author_Institution
    Dept. of Electron. Eng., Xi´´an Jiaotong Univ., China
  • Volume
    15
  • Issue
    3
  • fYear
    1992
  • fDate
    6/1/1992 12:00:00 AM
  • Firstpage
    378
  • Lastpage
    385
  • Abstract
    The tribological characteristic of an electroplated gold contact in a sealed relay was investigated. The morphology and contamination of cylinder flat contacts under the actions of impacting and sliding in no- and low-load conditions were studied. The experimental results show that impact wear dominates at normally closed (NC) contacts, while sliding wear dominates at normally opened (NO) contacts. The major contact wear process is adhesion for a plated gold in-line contact. Adhesive wear can operate in both impact and sliding actions. Due to severe wear, the substrate materials are exposed, and therefore, contaminations such as oxidation, sulfidation, chlorination, and polymerization take place on the contact zones. It is the wear and contamination which cause the contact resistance to rise, and which then lead to contact failure
  • Keywords
    contact resistance; electrical contacts; electroplated coatings; gold; relays; wear; chlorination; contact failure; contact materials; contact resistance; contact wear process; contact zones; contamination; cylinder flat contacts; electroplated Au films; experimental results; impact wear; low voltage contacts; low-load conditions; morphology; noble metal contacts; normally closed contacts; normally open contacts; oxidation; polymerization; sealed relay; severe wear; sliding wear; substrate materials; sulfidation; tribological characteristic; Adhesives; Contact resistance; Gold; Instruments; Oxidation; Polymers; Relays; Substrates; Surface contamination; Surface morphology;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.148506
  • Filename
    148506