DocumentCode
1102896
Title
Wear and contamination of electroplated gold films in line contact
Author
Chen, Zhuan-Ke
Author_Institution
Dept. of Electron. Eng., Xi´´an Jiaotong Univ., China
Volume
15
Issue
3
fYear
1992
fDate
6/1/1992 12:00:00 AM
Firstpage
378
Lastpage
385
Abstract
The tribological characteristic of an electroplated gold contact in a sealed relay was investigated. The morphology and contamination of cylinder flat contacts under the actions of impacting and sliding in no- and low-load conditions were studied. The experimental results show that impact wear dominates at normally closed (NC) contacts, while sliding wear dominates at normally opened (NO) contacts. The major contact wear process is adhesion for a plated gold in-line contact. Adhesive wear can operate in both impact and sliding actions. Due to severe wear, the substrate materials are exposed, and therefore, contaminations such as oxidation, sulfidation, chlorination, and polymerization take place on the contact zones. It is the wear and contamination which cause the contact resistance to rise, and which then lead to contact failure
Keywords
contact resistance; electrical contacts; electroplated coatings; gold; relays; wear; chlorination; contact failure; contact materials; contact resistance; contact wear process; contact zones; contamination; cylinder flat contacts; electroplated Au films; experimental results; impact wear; low voltage contacts; low-load conditions; morphology; noble metal contacts; normally closed contacts; normally open contacts; oxidation; polymerization; sealed relay; severe wear; sliding wear; substrate materials; sulfidation; tribological characteristic; Adhesives; Contact resistance; Gold; Instruments; Oxidation; Polymers; Relays; Substrates; Surface contamination; Surface morphology;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.148506
Filename
148506
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