• DocumentCode
    1103363
  • Title

    Low temperature identification of interfacial and bulk defects in Al/SiO2/Si capacitor structures by electron beam induced current

  • Author

    Kirk, H.R. ; Radzimski, Z. ; Buczkowski, A. ; Rozgonyi, G.A.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    41
  • Issue
    6
  • fYear
    1994
  • fDate
    6/1/1994 12:00:00 AM
  • Firstpage
    959
  • Lastpage
    963
  • Abstract
    A low temperature electron beam induced current (EBIC) study using Al/SiO2/Si capacitors as probes of defects affecting the electrical properties of the bulk Si, SiO2 interface and the SiO2 layer is presented. The technique´s relevance to current research on thin oxides and EBIC image enhancements obtained at reduced temperature are explained. The characteristic EBIC contrast representative of three capacitor bias conditions are reviewed as follows: 1) localized temperature dependent recombination at extended bulk defects for inversion bias, 2) spatial variation of the flat-band voltage due to nonuniform interfacial or oxide charge distributions for weak depletion bias, and 3) electron beam enhancement of SiO2 leakage currents at defect sites for accumulation bias. Illustrations of these contrast modes are presented for samples containing buried epitaxial misfit dislocations and oxide interface defects
  • Keywords
    EBIC; aluminium; dislocations; elemental semiconductors; leakage currents; metal-insulator-semiconductor devices; semiconductor-insulator boundaries; silicon; silicon compounds; Al-SiO2-Si; EBIC; EBIC image enhancements; MOS capacitor structures; SiO2 interface; SiO2 layer; SiO2 leakage currents; accumulation bias; bulk Si; bulk defects; buried epitaxial misfit dislocations; capacitor probes; contrast modes; electrical properties; electron beam enhancement; electron beam induced current; flat-band voltage; interfacial defects; localized temperature dependent recombination; low temperature identification; nonuniform interfacial charge distribution; nonuniform oxide charge distribution; thin oxides; Boron alloys; Buffer layers; Electron beams; Kirk field collapse effect; MOS capacitors; Oxidation; Probes; Scanning electron microscopy; Substrates; Temperature;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.293308
  • Filename
    293308