Title :
The effect of body resistance on the breakdown characteristics of SOI MOSFET´s
Author :
Suh, Dongwook ; Fossum, Jerry G.
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
fDate :
6/1/1994 12:00:00 AM
Abstract :
The drain-source breakdown of (nonfully depleted) SOI MOSFET´s is analyzed with attention paid to the body (to source) resistance, RB . Simple but physical characterizations of the holding voltage and the snapback voltage in terms of device parameters are derived. The physical insight afforded reveals that the snapback characteristic is an inherent effect of finite RB. The holding voltage increases with decreasing RB, but for submicron devices the increase is not significant unless RB is decreased well below values achieved with typical intrinsic body-to-source ties having acceptable (limited) widths
Keywords :
impact ionisation; insulated gate field effect transistors; semiconductor-insulator boundaries; silicon; SOI MOSFETs; body resistance; breakdown characteristics; device parameters; drain-source breakdown; holding voltage; intrinsic body-to-source ties; snapback voltage; submicron devices; Breakdown voltage; Detectors; Electric breakdown; Immune system; Infrared imaging; MOSFET circuits; Multiplexing; Optical noise; Temperature; Transfer functions;
Journal_Title :
Electron Devices, IEEE Transactions on