DocumentCode :
1103667
Title :
A fully complementary BiCMOS technology for 10 V mixed-signal circuit applications
Author :
Ito, Akira ; Church, Michael D. ; Rhee, Choong-Sun ; Johnston, Jeffrey M. ; Gasner, J.T. ; Ligon, William A. ; Begley, Patrick A. ; DeJong, Glenn A.
Author_Institution :
Harris Corp., Melbourne, FL, USA
Volume :
41
Issue :
7
fYear :
1994
fDate :
7/1/1994 12:00:00 AM
Firstpage :
1149
Lastpage :
1160
Abstract :
A 10 V fully complementary BiCMOS technology, HBC-10, has been developed for high speed, low noise and high precision mixed signal system integration applications. In this technology, two varieties of CMOS transistors have been implemented for 10 V analog and 5 V digital applications. A gate oxide thickness of 30 nm is utilized for the 10 V CMOS transistors with a lightly doped drain extension added to the NMOS structure to achieve device lifetime in excess of 10 years. A gate oxide thickness of 18 nm is used for 5 V CMOS logic circuits. These transistors are specially architected so that they may also serve as analog transistors in 5 V circuit applications. The 5 V NMOS transistor lifetime is guaranteed by use of a double diffused drain structure. The active devices are isolated by a fully recessed 1.5 μm oxide grown under high pressure conditions. Use of high pressure steam, plus combining diffusion operations where possible, results in a low overall thermal budget. This allows the up-diffusion of buried layers to be minimized so that a thin, 1.6 μm epitaxial silicon layer is sufficient to support 10 V bipolar transistors. The resultant vertical PNP and NPN transistors are characterized with cut-off frequencies of more than 1.3 GHz and 5 GHz, respectively. Likewise, the associated products of the current gain and Early voltage of PNP and NPN bipolar transistors are more than 1000 and 6000 V, respectively. A precision, buried Zener diode (for voltage reference applications), PtSi Schottky diode, polysilicon-oxide-polysilicon capacitor and trimmable thin film resistor are integrated into this process. This wide variety of passive and active components is essential for system integration and has been carefully designed for precision analog applications. The total number of masking operations is 23, which includes double layer metallization
Keywords :
BiCMOS integrated circuits; integrated circuit technology; mixed analogue-digital integrated circuits; 1.3 GHz; 10 V; 5 GHz; 5 V; HBC-10; LDD; NMOS structure; PtSi; PtSi Schottky diode; Si; buried Zener diode; double diffused drain structure; double layer metallization; epitaxial silicon layer; fully complementary BiCMOS technology; high pressure steam; high speed; lightly doped drain extension; low noise; mixed-signal circuit applications; polysilicon-oxide-polysilicon capacitor; precision analog applications; transistor lifetime; trimmable thin film resistor; vertical NPN transistors; vertical PNP transistors; voltage reference applications; BiCMOS integrated circuits; Bipolar transistors; CMOS logic circuits; CMOS technology; Cutoff frequency; MOS devices; MOSFETs; Schottky diodes; Silicon; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.293342
Filename :
293342
Link To Document :
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