• DocumentCode
    110378
  • Title

    Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects

  • Author

    Majumder, Manoj Kumar ; Kaushik, B.K. ; Manhas, Sanjeev Kumar

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Indian Inst. of Technol. Roorkee, Roorkee, India
  • Volume
    56
  • Issue
    6
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1666
  • Lastpage
    1673
  • Abstract
    Mixed carbon nanotube bundles (MCBs) are considered to be highly potential interconnect solutions in the current nanoscale regime. Different MCBs with random and spatial arrangements are proposed based on the placements of single- and multiwalled carbon nanotubes (CNTs) (SWNTs and MWNTs) in a bundle. Propagation delay and dynamic crosstalk performances are analyzed using the modified equivalent single conductor model of proposed MCB topologies. Encouragingly, a significant reduction in propagation delay and crosstalk delay is observed for a spatial arrangement of an MCB wherein MWNTs are placed peripherally to the centrally located SWNTs. Typically, the average delay with and without crosstalk is improved by 82.8% and 80%, respectively, compared to the MCB having randomly distributed SWNTs and MWNTs.
  • Keywords
    VLSI; crosstalk; integrated circuit design; integrated circuit interconnections; multi-wall carbon nanotubes; single-wall carbon nanotubes; synchronisation; C; CNT; MCB topologies; MWNT; SWNT; carbon nanotube interconnects; crosstalk delay; dynamic cosstalk; equivalent single conductor model; mixed carbon nanotube bundles; multiwalled carbon nanotubes; propagation delay; single-carbon nanotubes; Analytical models; Capacitance; Crosstalk; Delays; Integrated circuit interconnections; Propagation delay; Carbon nanotube (CNT); VLSI interconnects; crosstalk; equivalent single conductor (ESC); in-phase and out-phase delay; mixed CNT bundle (MCB); propagation delay;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2014.2318017
  • Filename
    6812175