• DocumentCode
    1103962
  • Title

    Good things, small packages [microelectromechanical systems]

  • Author

    Anscombe, Nadya

  • Volume
    83
  • Issue
    3
  • fYear
    2004
  • Firstpage
    10
  • Lastpage
    13
  • Abstract
    While semiconductor chip manufacturers still suffer from the recent downturn, the future looks a little brighter for microelectromechanical systems (MEMS). Also called microsystems and micromachines, these devices are found in many diverse applications, such as air bag sensors, ink-jet heads, medical sensors and telecommunication switches. MEMS can be manufactured from a variety of materials using a variety of processes in a variety of steps. For the foundry industries, it creates problems because each process can only be used for one customer. Because of their application-specific nature, MEMS devices often have to be designed using proprietary manufacturing processes that are specific to one manufacturing facility. In this paper, the author examined the surrounding issues in manufacturing MEMS as well as the probable solutions hypothesized by different experts.
  • Keywords
    CMOS integrated circuits; design for manufacture; micromechanical devices; CMOS-compatible processes; foundry industries; manufacturing processes; microelectromechanical systems; micromachines; microsystems;
  • fLanguage
    English
  • Journal_Title
    Manufacturing Engineer
  • Publisher
    iet
  • ISSN
    0956-9944
  • Type

    jour

  • DOI
    10.1049/me:20040301
  • Filename
    1334722