Practices in Mixed-Signal and RF IC Testing

Author

Abdennadher, Salem ; Shaikh, Saghir A.

Author_Institution

Oregon State Univ., Corvallis

Volume

24

Issue

4

fYear

2007

Firstpage

332

Lastpage

339

Abstract

Mixed-signal (analog and digital) testing and RF testing pose major cost and quality challenges to the development of high-speed wired and wireless network and communication ICs. This article presents a brief overview of common industry practices for testing mixed-signal and RF ICs. We also present examples of DFT and BIST techniques for wired and wireless transceivers. Finally, we discuss the testing challenges of system-in-package (SiP) products and selected DFT approaches in use today.

Keywords

integrated circuit testing; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; system-in-package; BIST technique; DFT technique; RF IC testing; analog-digital testing; communication IC; high-speed wired network development; high-speed wireless network development; mixed-signal testing; system-in-package testing; wired transceiver; wireless transceiver; Analog integrated circuits; Built-in self-test; Circuit faults; Circuit testing; Costs; Design for testability; Integrated circuit testing; Radio frequency; Radiofrequency integrated circuits; System testing; ATE; DFT; I/O testing; SiP testing; built-in tests; wireless transceiver testing;

fLanguage

English

Journal_Title

Design & Test of Computers, IEEE

Publisher

ieee

ISSN

0740-7475

Type

jour

DOI

10.1109/MDT.2007.143

Filename

4293178