Title :
Bending strain study of Bi-2223/Ag tapes using Hall sensor magnetometry
Author :
Lahtinen, Markku ; Paasi, Jaakko ; Sarkaniemi, Jyrki ; Han, Zhenghe ; Freltoft, Torsten
Author_Institution :
Lab. of Electr. & Magnetism, Tampere Univ. of Technol., Finland
fDate :
7/1/1996 12:00:00 AM
Abstract :
The influence of room temperature bending on critical current (I c) of Bi-2223/Ag tapes is studied by Hall sensor magnetometry, four-point method and scanning electron microscopy. Hall sensor magnetometry allows us to assess tape homogeneity and the amount of mechanical damage caused by bending. The microstructure of the Bi-2223 ceramic is found to strongly affect the tape behavior under bending strain. In a tape with moderate Ic=6.1 A at 77 K and a porous ceramic core, crack propagation took place normal to the Ag-ceramic interface, whereas in tapes with dense core, Ic above 10 A at 77 K, cracks propagated in the tape plane. In monofilamentary tapes core homogeneity correlated with good bending strain performance. In multifilamentary tapes crack propagation between filaments was prohibited by the Ag matrix, thus leading to enhanced strain tolerance. In the high Ic tapes studied, bending to 25 mm radius resulted in 1%-2% Ic degradation
Keywords :
bending; bismuth compounds; calcium compounds; critical current density (superconductivity); high-temperature superconductors; magnetic field measurement; multifilamentary superconductors; scanning electron microscopy; silver; strain measurement; strontium compounds; 10 A; 77 K; Bi-2223/Ag tapes; Bi2Sr2Ca2Cu3O10 -Ag; Hall sensor magnetometry; bending strain; crack propagation; critical current; four-point method; high temperature superconductor; mechanical damage; microstructure; monofilamentary tapes; multifilamentary tapes; porous ceramic core; room temperature bending; scanning electron microscopy; strain tolerance; tape homogeneity; Capacitive sensors; Ceramics; Critical current; Magnetic field induced strain; Magnetic force microscopy; Magnetic sensors; Mechanical sensors; Microstructure; Scanning electron microscopy; Temperature sensors;
Journal_Title :
Magnetics, IEEE Transactions on