Holographic pattern measuring system and its application to deformation analysis of printed circuit board due to heat of mounted parts

Author

Taniguchi, Masanari ; Takagi, Tasuku

Author_Institution

Fac. of Sci. & Technol., Meijo Univ., Nagoya, Japan

Volume

43

Issue

2

fYear

1994

fDate

4/1/1994 12:00:00 AM

Firstpage

326

Lastpage

331

Abstract

A new measuring system, holographic pattern measuring system (HPMS), was developed which is composed of both techniques of holographic interferometry and graphic image processing, and applied to deformation analysis of the printed circuit board (PCB) due to heat of mounted parts. The HPMS was applied to obtain the three-dimensional graphic image pattern of the deformation of-the PCB due to thermal stress with an error of 0.1 μm. In addition, the thermographic pattern was obtained by using a thermography system, and a comparison was made of the fringe pattern (holographic pattern) obtained by the HPMS and the thermographic pattern of the PCB surface due to thermal stress. We found that the holographic pattern was different from the thermographic pattern. The results showed that it was difficult to estimate the thermal deformation of the PCB from the thermographic pattern

Keywords

calibration; deformation; displacement measurement; holographic interferometry; image processing equipment; printed circuit testing; printed circuits; stress measurement; thermal stresses; deformation; deformation analysis; fringe pattern; graphic image processing; heat of mounted parts; holographic interferometry; holographic pattern measurement; printed circuit board; thermal deformation; thermal stress; thermographic pattern; three-dimensional graphic image pattern; Circuit analysis; Displacement measurement; Electronic packaging thermal management; Graphics; Holography; Laser beams; Optical interferometry; Pattern analysis; Printed circuits; Thermal stresses;

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/19.293443

Filename

293443