• DocumentCode
    1104748
  • Title

    Electrical conductivity of high-strength Cu-Nb microcomposites

  • Author

    Kozlenkova, N.I. ; Pantsyrnyi, V.I. ; Nikulin, A.D. ; Shikov, A.K. ; Potapenko, I.I.

  • Author_Institution
    Bochvar (A.A.) All-Union Sci. Res. Inst. of Inorg. Mater., Moscow, Russia
  • Volume
    32
  • Issue
    4
  • fYear
    1996
  • fDate
    7/1/1996 12:00:00 AM
  • Firstpage
    2921
  • Lastpage
    2924
  • Abstract
    The conductivity of Cu-Nb microcomposites was studied as a function of the composition and the parameters of the microstructure varying with the degree of deformation. The effect of heat treatment on conductivity of Cu and composites is also considered. The conductivity of Cu-Nb composites with the reduction in area lnA0/A<4.9 is well described by the Landauer formula allowing for conductivity and the volume fraction of the components. The influence of the principal scattering mechanisms on conductivity of Cu in the composite is treated on the grounds of the experimental results obtained in this work and the analysis of the literary data. The linear correlation between strength and conductivity is obtained for the specimens heat treated at temperatures up to 600°C. This correlation is violated, however, for the specimens subjected to heat treatment at temperatures above 600°C
  • Keywords
    copper alloys; crystal microstructure; electrical conductivity; heat treatment; mechanical strength; multifilamentary superconductors; niobium alloys; plastic deformation; 0 to 900 degC; Cu-Nb; Landauer formula; components volume fraction; composites; composition; deformation; electrical conductivity; heat treatment; high-strength Cu-Nb microcomposites; microstructure; principal scattering mechanisms; strength; superconductor; Conductivity; Copper; Electric resistance; Electrodes; Furnaces; Heat treatment; Microstructure; Niobium; Scattering; Temperature;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.511487
  • Filename
    511487