• DocumentCode
    1104980
  • Title

    The use of rapid thermal processing to control dopant redistribution during formation of tantalum and molybdenum silicide/n+polysilicon bilayers

  • Author

    Cooper, C.B., III ; Powell, R.A.

  • Author_Institution
    Varian Associates, Inc., Palo Alto, CA
  • Volume
    6
  • Issue
    5
  • fYear
    1985
  • fDate
    5/1/1985 12:00:00 AM
  • Firstpage
    234
  • Lastpage
    236
  • Abstract
    The successful use of rapid thermal processing (RTP) to form Ta- and Mo-polycide structures is described. Samples were annealed by exposure to the blackbody radiation of a resistively-heated graphite heater in vacuum. Rapid redistribution of phosphorus in the bilayer structure is observed during the sintering process. Long-time high-temperature anneals can result in significant loss of dopant from the polycide structure. Data is presented to show that RTP parameters can be optimized to produce highly-conductive polycide structures with minimal dopant loss from the poly-Si layer, which is not possible for furnace-annealed samples.
  • Keywords
    Electrical resistance measurement; Helium; Metallization; Probes; Process control; Rapid thermal annealing; Rapid thermal processing; Semiconductor device modeling; Silicides; Temperature;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1985.26109
  • Filename
    1485262