DocumentCode
1104980
Title
The use of rapid thermal processing to control dopant redistribution during formation of tantalum and molybdenum silicide/n+polysilicon bilayers
Author
Cooper, C.B., III ; Powell, R.A.
Author_Institution
Varian Associates, Inc., Palo Alto, CA
Volume
6
Issue
5
fYear
1985
fDate
5/1/1985 12:00:00 AM
Firstpage
234
Lastpage
236
Abstract
The successful use of rapid thermal processing (RTP) to form Ta- and Mo-polycide structures is described. Samples were annealed by exposure to the blackbody radiation of a resistively-heated graphite heater in vacuum. Rapid redistribution of phosphorus in the bilayer structure is observed during the sintering process. Long-time high-temperature anneals can result in significant loss of dopant from the polycide structure. Data is presented to show that RTP parameters can be optimized to produce highly-conductive polycide structures with minimal dopant loss from the poly-Si layer, which is not possible for furnace-annealed samples.
Keywords
Electrical resistance measurement; Helium; Metallization; Probes; Process control; Rapid thermal annealing; Rapid thermal processing; Semiconductor device modeling; Silicides; Temperature;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1985.26109
Filename
1485262
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