DocumentCode :
1104980
Title :
The use of rapid thermal processing to control dopant redistribution during formation of tantalum and molybdenum silicide/n+polysilicon bilayers
Author :
Cooper, C.B., III ; Powell, R.A.
Author_Institution :
Varian Associates, Inc., Palo Alto, CA
Volume :
6
Issue :
5
fYear :
1985
fDate :
5/1/1985 12:00:00 AM
Firstpage :
234
Lastpage :
236
Abstract :
The successful use of rapid thermal processing (RTP) to form Ta- and Mo-polycide structures is described. Samples were annealed by exposure to the blackbody radiation of a resistively-heated graphite heater in vacuum. Rapid redistribution of phosphorus in the bilayer structure is observed during the sintering process. Long-time high-temperature anneals can result in significant loss of dopant from the polycide structure. Data is presented to show that RTP parameters can be optimized to produce highly-conductive polycide structures with minimal dopant loss from the poly-Si layer, which is not possible for furnace-annealed samples.
Keywords :
Electrical resistance measurement; Helium; Metallization; Probes; Process control; Rapid thermal annealing; Rapid thermal processing; Semiconductor device modeling; Silicides; Temperature;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1985.26109
Filename :
1485262
Link To Document :
بازگشت