Electrical Conductivity Discontinuity at Melt in Phase Change Memory

Author

Crespi, Luca ; Ghetti, Andrea ; Boniardi, Mattia ; Lacaita, Andrea L.

Author_Institution

Dipt. di ElettronicaInformazione e Bioingegneria, Politec. di Milano, Milan, Italy

Volume

35

Issue

7

fYear

2014

fDate

Jul-14

Firstpage

747

Lastpage

749

Abstract

Discontinuity of electrical and thermal conductivity values at melt has been reported in phase change materials. Signatures of the effect are found in phase change memory cells with Wall architecture. A quantitative model describing the dependence on temperature of electrical and thermal conductivity values of the phase change alloy is introduced, covering the range from solid phase to beyond melt. The model has been implemented in a 3-D electro-thermal TCAD tool and successfully validated against the experimental results.

Keywords

electrical conductivity; melt processing; phase change materials; phase change memories; thermal conductivity; 3D electro-thermal TCAD tool; electrical conductivity discontinuity; melt; phase change alloy; phase change materials; phase change memory; quantitative model; solid phase; temperature dependence; thermal conductivity; wall architecture; Conductivity; Phase change materials; Phase change memory; Temperature dependence; Temperature distribution; Temperature measurement; Thermal conductivity; Phase change memories; electrical conductivity; electrical conductivity.; non-volatile memories;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/LED.2014.2320967

Filename

6812189