Title :
Crosstalk Rejection in 3-D-Stacked Interchip Communication With Blind Source Separation
Author :
El-Sankary, Kamal ; Asai, Tetsuya ; Motomura, Masato ; Kuroda, Tadahiro
Author_Institution :
Dept. of Electr. & Comput. Eng., Dalhousie Univ., Halifax, NS, Canada
Abstract :
A blind source separation (BSS) is proposed to reject the crosstalk between inductive-coupling channels in 3-D systems. The phase and permutation ambiguities inherent to BSS are compensated for in the proposed technique. A continuous-time natural gradient BSS with integrator output swing bounding, which is amenable for high-speed implementation, is also proposed. Techniques to reduce the implementation complexity for a large channel array are presented. The proposed technique shows substantial improvement results for crosstalk rejection in a high-crosstalk-coupling environment. In addition, for a 3 × 3 array channel with 1 Gb/s/channel, with a crosstalk-to-signal ratio of -3 dB, a bit-error rate of 10-11 is obtained compared to 10-4 without BSS.
Keywords :
blind source separation; coupled circuits; crosstalk; error statistics; integrating circuits; three-dimensional integrated circuits; 3D-stacked interchip communication; bit-error rate; blind source separation; channel array; continuous-time natural gradient BSS; crosstalk rejection; crosstalk-to-signal ratio; high-crosstalk coupling environment; inductive-coupling channel; integrator output swing bounding; Arrays; Blind source separation; Coils; Complexity theory; Couplings; Crosstalk; 3D integrated circuits; Blind source separation (BSS); blind source separation; crosstalk rejection; inter-chip Communication; interchip communication; three-dimensional (3-D) integrated circuits (ICs);
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2015.2415258
