Design, modeling, and characterization of FET-SEED smart pixel transceiver arrays for optical backplanes

Author

Plant, David V. ; Shang, Alain Z. ; Otazo, Marcos R. ; Rolston, David R. ; Robertson, Brian ; Hinton, H. Scott

Author_Institution

Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada

Volume

32

Issue

8

fYear

1996

fDate

8/1/1996 12:00:00 AM

Firstpage

1391

Lastpage

1398

Abstract

The design, modeling, and characterization of FET-SEED smart pixel transceiver arrays fabricated for application in optical backplanes are presented. Results of digital and analog measurements on 4×4 transmitter arrays and 4×4 receiver arrays, packaged at the printed circuit-board level, will be presented. In addition, these results will be compared to device and circuit models developed for these optoelectronics. Finally, the description of the successful application of these optoelectronics to interconnect two printed circuit boards will be described

Keywords

SEEDs; field effect integrated circuits; integrated circuit design; integrated circuit modelling; integrated circuit packaging; integrated optoelectronics; optical interconnections; optical receivers; optical transmitters; printed circuits; smart pixels; transceivers; 4×4 receiver arrays; 4×4 transmitter arrays; FET-SEED smart pixel transceiver array fabrication; FET-SEED smart pixel transceiver arrays; analog measurements; circuit models; design; digital measurements; modeling; optical backplanes; optoelectronics; printed circuit-board level packaging; Backplanes; Integrated circuit interconnections; Optical arrays; Optical design; Optical receivers; Optical transmitters; Packaging; Printed circuits; Smart pixels; Transceivers;

fLanguage

English

Journal_Title

Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

0018-9197

Type

jour

DOI

10.1109/3.511552

Filename

511552