Evaluation of excess inductance and capacitance of microstrip junctions

Author

Sarkar, T.K. ; Maricevic, Z.A. ; Zhang, J.B. ; Djordjevic, A.R.

Author_Institution

Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA

Volume

42

Issue

6

fYear

1994

fDate

6/1/1994 12:00:00 AM

Firstpage

1095

Lastpage

1097

Abstract

Excess inductance and capacitance of various microstrip discontinuities (bends, impedance steps, and simple vias) are evaluated. For the inductance calculations, the structure is assumed to consist of perfectly conducting foils located in vacuum above a perfectly conducting ground plane. For the capacitance calculations, the structure is assumed to be embedded in a multilayered dielectric medium. The surface-current distribution for the excess inductance calculation and the surface-charge distribution for the capacitance calculation are evaluated numerically solving integral equations based on the boundary conditions. Thereby, the conductor and dielectric surfaces are divided into a number of triangles, and the point-matching technique is used.<>

Keywords

boundary-elements methods; capacitance; inductance; integral equations; microstrip lines; static electrification; waveguide theory; bends; boundary conditions; excess capacitance; excess inductance; impedance steps; inductance calculations; integral equations; microstrip discontinuities; microstrip junctions; multilayered dielectric medium; perfectly conducting foils; perfectly conducting ground plane; point-matching technique; surface-charge distribution; surface-current distribution; Capacitance; Conductors; Current distribution; Dielectrics; Inductance; Integral equations; Microstrip; Surface impedance; Transmission line discontinuities; Transmission lines;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.293585

Filename

293585