• DocumentCode
    1105887
  • Title

    Fabrication of high-mobility p-channel poly-Si thin film transistors by self-aligned metal-induced lateral crystallization

  • Author

    Lee, Seok-Woon ; Ihn, Tae-Hyung ; Joo, Seung-Ki

  • Author_Institution
    Samsung Co., Kyungki Do, South Korea
  • Volume
    17
  • Issue
    8
  • fYear
    1996
  • Firstpage
    407
  • Lastpage
    409
  • Abstract
    High-mobility p-channel poly-Si TFTs were fabricated using a new low-temperature process (/spl les/500/spl deg/C): self-aligned metal-induced lateral crystallization (MILC). With a one-step annealing at 500/spl deg/C, activation of dopants in source/drain/gate a-Si films as well as the crystallization of channel a-Si films was achieved. The TFTs showed a threshold voltage of -1.7 V, and an on/off current ratio of /spl sim/10/sup 7/ without post-hydrogenation. The mobility was measured to be as high as 90 cm/sup 2//V/spl middot/s, which is two to three times higher than that of the poly-Si TFTs fabricated by conventional solid-phase crystallization at around 600/spl deg/C.
  • Keywords
    MOSFET; annealing; carrier mobility; elemental semiconductors; semiconductor technology; silicon; thin film transistors; -1.7 V; 500 C; Si; fabrication process; high-mobility TFT; low-temperature process; one-step annealing; p-channel TFT; poly-Si TFT; polysilicon; self-aligned metal-induced lateral crystallization; thin film transistors; Annealing; Crystallization; Dielectric substrates; Fabrication; Hydrogen; Nickel; Optical films; Temperature; Thin film transistors; Wet etching;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.511590
  • Filename
    511590