A new MISS switching device structure was designed and fabricated, which consists of Al/thin thermal oxide/p-n
+-p-Si layers and is isolated by diffusing n-well to the buried n
+layer. Furthermore, an N
+-shield layer which confines the carrier flow to the MIS interface and a p
+-gate which injects carriers in the n
+-p junction were successfully implemented. The device reveals that switching and holding voltages V
sand V
Hboth decrease with increasing

, and with decreasing

. The fringing effect is minimized due to the isolated structure.