DocumentCode :
1106181
Title :
Process and performance comparison of an 8K × 8-bit SRAM in three stacked CMOS technologies
Author :
Hite, L.R. ; Sundaresan, R. ; Malhi, S.D.S. ; Lam, H.W. ; Shah, A.H. ; Hester, R.K. ; Chatterjee, P.K.
Author_Institution :
Texas Instruments, Inc., Dallas, TX, USA
Volume :
6
Issue :
10
fYear :
1985
fDate :
10/1/1985 12:00:00 AM
Firstpage :
548
Lastpage :
550
Abstract :
Using self-aligned and non-self-aligned stacked CMOS technologies experimental 8K × 8-bit static random-access memories (SRAM´S) have been fabricated. Hydrogen passivation has been used to improve the performance of polysilicon devices. An 8K × 8-bit SRAM using non-self-aligned memory cells and employing a CW argon laser to anneal the second (active) polysilicon layer has also been fabricated. The fabrication methods and performances of all three SRAM´s have been compared.
Keywords :
Annealing; Boron; CMOS process; CMOS technology; Geometry; Hydrogen; Implants; Passivation; Random access memory; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1985.26225
Filename :
1485378
Link To Document :
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