• DocumentCode
    1106181
  • Title

    Process and performance comparison of an 8K × 8-bit SRAM in three stacked CMOS technologies

  • Author

    Hite, L.R. ; Sundaresan, R. ; Malhi, S.D.S. ; Lam, H.W. ; Shah, A.H. ; Hester, R.K. ; Chatterjee, P.K.

  • Author_Institution
    Texas Instruments, Inc., Dallas, TX, USA
  • Volume
    6
  • Issue
    10
  • fYear
    1985
  • fDate
    10/1/1985 12:00:00 AM
  • Firstpage
    548
  • Lastpage
    550
  • Abstract
    Using self-aligned and non-self-aligned stacked CMOS technologies experimental 8K × 8-bit static random-access memories (SRAM´S) have been fabricated. Hydrogen passivation has been used to improve the performance of polysilicon devices. An 8K × 8-bit SRAM using non-self-aligned memory cells and employing a CW argon laser to anneal the second (active) polysilicon layer has also been fabricated. The fabrication methods and performances of all three SRAM´s have been compared.
  • Keywords
    Annealing; Boron; CMOS process; CMOS technology; Geometry; Hydrogen; Implants; Passivation; Random access memory; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1985.26225
  • Filename
    1485378