A High-Sensitivity Electric Probe Based on Board-Level Edge Plating and LC Resonance

Author

Eakhwan Song ; Hyun Ho Park

Author_Institution

Dept. of Electron. & Commun. Eng., Kwangwoon Univ., Seoul, South Korea

Volume

24

Issue

12

fYear

2014

fDate

Dec. 2014

Firstpage

908

Lastpage

910

Abstract

A near-field probe fabricated on a printed circuit board (PCB) with a high sensitivity to electric fields is proposed. To achieve high sensitivity, board-level edge plating technology is employed to realize a copper patch replacing conventional pin-type electrodes. In addition, the sensitivity is further enhanced at a specific frequency band based on LC resonance. The proposed electric probe has been experimentally validated by near-field measurements on an application processor (AP) used in latest mobile phones with a sensitivity enhancement of around 20 dB in the Global Positional System (GPS) band compared to a commercial electric probe.

Keywords

electric field measurement; electric noise measurement; electromagnetic interference; mobile handsets; LC resonance; application processor; board level edge plating; copper patch; electric fields; global positional system band; high sensitivity electric probe; mobile phones; near field measurements; near field probe; sensitivity enhancement; Electric fields; Gain measurement; Inductors; Probes; Resonant frequency; Sensitivity; Edge plating; LC resonance; electric field; field probe; radio-frequency interference (RFI); sensitivity;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2014.2361433

Filename

6924809