• DocumentCode
    1108208
  • Title

    Design and testing of a high temperature superconducting current lead

  • Author

    Wu, J.L. ; Dederer, J.T. ; Eckels, P.W. ; Singh, S.K. ; Hull, J.R. ; Poeppel, R.B. ; Youngdahl, C.A. ; Singh, J.P. ; Lanagan, M.T. ; Balachandran, U.

  • Author_Institution
    Westinghouse Sci. & Technol. Center, Pittsburgh, PA, USA
  • Volume
    27
  • Issue
    2
  • fYear
    1991
  • fDate
    3/1/1991 12:00:00 AM
  • Firstpage
    1861
  • Lastpage
    1865
  • Abstract
    The high critical temperature and low thermal conductivity of the ceramic superconductor Y-Ba-Cu-O were utilized to reduce the Joule heating and the heat leak in a vapor-cooled current lead design of nominally 1-kA capacity. The lead consists of a lower superconducting part and an upper normal metal (copper) part. The superconducting part is an assembly of 20 rectangular bars fabricated from a composite of Y-Ba-Cu-O and Ag (15% vol.). This part is designed to operate below the critical temperature of the ceramic superconductor. The copper part, consisting of 20 copper wires, extends outside of the cryostat and interfaces to the room-temperature power supply. The lead was successfully tested in a liquid-helium cryostat for currents up to 2 kA. At the optimum operating currents of 1.7-1.8 kA, the helium boil-off measurements show heat leak reduction of approximately 40% from the conventional designs. Details of the design, fabrication issues, and the testing are presented
  • Keywords
    cable testing; copper compounds; high-temperature superconductors; superconducting cables; yttrium compounds; 1 to 2 kA; Joule heating; YBaCuO ceramic; fabrication; heat leak; high temperature superconducting current lead; testing; vapor-cooled current lead design; Assembly; Bars; Ceramics; Heating; High temperature superconductors; Power supplies; Superconducting filaments and wires; Testing; Thermal conductivity; Yttrium barium copper oxide;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.133559
  • Filename
    133559