Title :
Millimeter-Wave Wireless Interconnect for 3-D SIC Testing
Author :
Lu, Julia Hsin-Lin ; Wing-Fai Loke ; Byunghoo Jung
Author_Institution :
Purdue Univ., West Lafayette, IN, USA
Abstract :
As 3-D ICs gain popularity in the industry, finding an efficient way to test the stacked chips is becoming a new challenge. The authors of this paper present a contact-free testing method using millimeter-wave wireless I/Os with microbump antennas. This method has the potential to reduce the latency and cost of 3-D IC testing.
Keywords :
integrated circuit interconnections; integrated circuit testing; millimetre wave antennas; millimetre wave integrated circuits; three-dimensional integrated circuits; 3D SIC testing; I-O; contact-free testing method; microbump antennas; millimeter-wave wireless interconnect; stacked integrated circuits; Antennas; Integrated circuit interconnections; Millimeter wave circuits; Silicon; Silicon carbide; Testing; Transceivers; Wireless communication;
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDAT.2014.2343191
