DocumentCode :
1109491
Title :
Performance of nonplanar silicon diaphragms under large deflections
Author :
Zhang, Yafan ; Wise, Kensall D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume :
3
Issue :
2
fYear :
1994
fDate :
6/1/1994 12:00:00 AM
Firstpage :
59
Lastpage :
68
Abstract :
The successful realization of many high-performance microactuators, including many microvalves and micropumps, depends critically on the development of diaphragms which are capable of large displacements and free from fatigue. Thin nonplanar silicon diaphragms are promising candidates for such applications since they can be batch fabricated using techniques and materials that are compatible with the other portions of these devices. This paper reports the detailed simulation, fabrication, and characterization of such diaphragms, which are corrugated-bossed structures that unfold, accordion-like, to produce high boss deflections. Boron-doped diaphragms 1 mm on a side, 3 μm in thickness, and containing five 10-μm-deep corrugations produce boss deflections of more than 30 μm at 760 mmHg, in close agreement with simulations. The maximum deflection measured at diaphragm fracture is 38 μm under a 1050 mmHg differential pressure. The effects on load-deflection performance due to changes in diaphragm internal stress (residual stress), corrugation profile, and diaphragm thickness are also explored
Keywords :
diaphragms; electric actuators; elemental semiconductors; micromechanical devices; silicon; 10 micron; 760 to 1050 mmHg; Si:B; batch fabrication; boss deflections; corrugated-bossed structures; corrugation profile; diaphragm fracture; diaphragm internal stress; diaphragm thickness; high-performance microactuators; load-deflection performance; micropumps; microvalves; nonplanar silicon diaphragms; Analytical models; Boron; Fabrication; Finite element methods; Internal stresses; Micropumps; Microvalves; Residual stresses; Silicon; Wet etching;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.294322
Filename :
294322
Link To Document :
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