Variable Frequency Microwave Curing of Amide-Epoxy Based Polymers

Irradiation of a dielectric material with microwave irradiation results in energy transfer due to rotational-vibrational transitions within the molecule. The energy transfer results in a local rise in temperature within the material. Microwave-induced reactions can occur at a lower average temperature than convective heating resulting in faster thermal curing of polymer dielectrics because the energy absorption is localized at particular sites. In this study, variable frequency microwave (VFM) curing of epoxy-based dielectric films was investigated. The microwave energy was swept through a range of frequencies to dissipate standing waves so that metallic conductors could be present with the dielectric films. The rate of reaction and film properties of polyamideimide (PAI) and bisphenol A epoxy resin (BPAEp) were studied. Benzanilide and BPAEp were used as model compounds for the reaction between the amide and epoxy. Compared to convective heating, the microwave reaction rates were higher at each isothermal cure temperature. The resulting mechanical properties of the films cured by microwave heated were superior to thermally cured materials. The elastic modulus of VFM cured PAI/BPAEp films was less than that of thermally cured films and the elongation to break was twice as high. Further, the adhesion to copper was improved with microwave processing. The chemical structure of the VFM cured polymer was different from the thermally cured polymer, based on Fourier transform infrared analysis, and is likely the origin of the improved properties.