DocumentCode :
1110022
Title :
Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits
Author :
Qin, Jie ; Ramahi, Omar M. ; Granatstein, Victor
Author_Institution :
Univ. of Maryland, College Park
Volume :
49
Issue :
3
fYear :
2007
Firstpage :
661
Lastpage :
669
Abstract :
Planar electromagnetic bandgap (EBG) structures with novel meandered lines and super cell configuration are proposed for mitigating simultaneous switching noise propagation in high-speed printed circuit boards. An ultrawide bandgap extending from 250 MHz to 12 GHz and beyond is demonstrated by both simulation and measurement, and a good agreement is observed. These perforated EBG-based power planes may cause spurious and unwanted radiation. In this paper, leakage radiation through these imperfect planes is carefully investigated. It is found that the leakage field from these planar EBG structures is highly concentrated around the feed point, and the field intensity is attenuated dramatically when passing across several periods of patches. A novel concept of using these EBG structures for electromagnetic interference reduction is also introduced. Finally, the impact of power plane with EBG-patterned structures on signal integrity is studied.
Keywords :
electromagnetic interference; interference suppression; photonic band gap; printed circuits; EBG-patterned structures; EMI reduction; electromagnetic interference reduction; high-speed printed circuit boards; leakage radiation; planar EBG structures; planar electromagnetic bandgap structures; power planes; switching noise mitigation; ultrawide bandgap; Circuit noise; Circuit simulation; Electromagnetic interference; Electromagnetic propagation; Metamaterials; Noise reduction; Periodic structures; Photonic band gap; Printed circuits; Switching circuits; Electromagnetic bandgap (EBG); electromagnetic interference (EMI); signal integrity (SI); simultaneous switching noise (SSN);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2007.902193
Filename :
4295217
Link To Document :
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