DocumentCode
1110268
Title
Physics, technology, and modeling of polysilicon emitter contacts for VLSI bipolar transistors
Author
Patton, Gary L. ; Bravman, John C. ; Plummer, James D.
Author_Institution
IBM Thomas J. Watson Research Center, Yorktown Heights, NY
Volume
33
Issue
11
fYear
1986
fDate
11/1/1986 12:00:00 AM
Firstpage
1754
Lastpage
1768
Abstract
The physics of minority-carrier injection into polysilicon-contacted emitters has been studied through a series of experiments correlating the base current of the transistor to the structure of the polysilicon/single-crystal silicon interface. Most of the relevant material and processing parameters have been examined. In addition, a novel approach has been taken in the modeling of transport in these emitters to quantify the minority-carrier blocking properties of the polysilicon contacts. Experimental results show that extremely low values of base current can be obtained for devices etched in HF prior to the polysilicon deposition, i.e., devices with only a remnant "native" oxide layer at the polysilicon/single-crystal silicon interface. For these devices, the base current is mainly determined by the recombination and blocking of minority carriers at the polysilicon/monosilicon interface. A number of competing mechanisms exist in several domains of doping, temperature, and time which influence the properties of this interface. One of these mechanisms is the blocking of minority carriers by the native oxide layer itself. The uniformity and, consequently, the blocking characteristics of this layer were found to be strongly affected by the polysilicon doping level and thermal treatment.
Keywords
Bipolar transistors; Chemicals; Doping; Etching; Hafnium; Laboratories; Physics; Silicon; Tunneling; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1986.22738
Filename
1485955
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