Title :
C-SAM sounds the warning for IC packaging defects
Author :
Yalamanchili, Prasad ; Christou, Aris ; Martell, Steve ; Rust, Carl
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fDate :
7/1/1994 12:00:00 AM
Abstract :
C-mode acoustic microscopy provides unique advantages over SLAM techniques in detecting microcracks, voids, and delaminations. The reliability of integrated circuit (IC) packages depends in many respects on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids, microcracks or delaminations may not be evident in the electrical performance characteristics, but may cause premature failure. C-mode scanning acoustic microscopy (C SAM) is an excellent tool for non-destructive failure analysis of IC packages. It provides a rapid and comprehensive imaging of critical package defects and the location of these defects in three dimensions within the package.<>
Keywords :
acoustic microscopy; circuit reliability; crack detection; delamination; failure analysis; integrated circuit testing; packaging; voids (solid); C-SAM; C-mode acoustic microscopy; C-mode scanning acoustic microscopy; IC package reliability; IC packaging defects; critical package defects; delaminations; electrical performance characteristics; mechanical integrity; microcracks; nondestructive failure analysis; poor bonding; premature failure; reliability; structural weaknesses; three dimensions; voids; Acoustic imaging; Acoustic signal detection; Bonding; Delamination; Electronics packaging; Failure analysis; Integrated circuit packaging; Laser modes; Microscopy; Simultaneous localization and mapping;
Journal_Title :
Circuits and Devices Magazine, IEEE
