DocumentCode :
1110534
Title :
Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port Correction
Author :
Wu, Kai-Bin ; Shiue, Guang-Hwa ; Guo, Wei-Da ; Lin, Chien-Min ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng. & Grad. Inst. of Commun. Eng., Nat. Taiwan Univ., Taipei
Volume :
31
Issue :
2
fYear :
2008
fDate :
5/1/2008 12:00:00 AM
Firstpage :
303
Lastpage :
310
Abstract :
An efficient Delaunay-Voronoi modeling of the power-ground planes suitable directly for SPICE compatibity is proposed to deal with the ground bounce noise and decoupling capacitors placement problems for the high-speed digital system designs. The model consists of virtual ports and triangular meshes with the lumped circuit elements, in which all the element values can be related to the mesh geometry shape by the analogy between the circuit equations and Maxwell´s equations. Since the analogy fails to apply due to the singular fields near the input/output pins, the via effect of driving and sensing ports is not negligible and an analytical expression from the Hankel function is thus presented for the correction term. A simple rule has been investigated for the model with minimum lumped circuit elements to accurately represent the power-ground planes over the frequency range of interests. The full-wave simulation and measurement results verify the good correlations with the proposed models for the impedance responses of regular and defective plane shapes.
Keywords :
Hankel transforms; Maxwell equations; SPICE; computational geometry; earthing; lumped parameter networks; mesh generation; Delaunay-Voronoi modeling; Hankel function; Maxwell equations; SPICE compatibity; circuit equations; full-wave simulation; ground bounce noise; high-speed digital system designs; impedance responses; lumped circuit elements; mesh geometry shape; power-ground planes; source port correction; triangular meshes; Delaunay triangular mesh; SPICE-compatible model; Voronoi tessellation; plane impedance; power distribution network; via effect; virtual port;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2008.920326
Filename :
4476035
Link To Document :
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