Title :
TM-RF: Aging-Aware Power-Efficient Register File Design for Modern Microprocessors
Author :
Na Gong ; Jinhui Wang ; Shixiong Jiang ; Sridhar, Ramalingam
Author_Institution :
Dept. of Electr. & Comput. Eng., North Dakota State Univ., Fargo, ND, USA
Abstract :
Modern microprocessors employ register files (RFs) for performance enhancement and achieving instruction level parallelism simultaneously. However, RF incurs large power consumption owing to the highly frequent access. Meanwhile, as technology scales, bias temperature instability has become a major reliability concern for RF designers. This paper presents an aging-aware trimodal register file (TM-RF) design to enhance the power efficiency. As instructions pass through the pipeline, TM-RF places the bit-cells in different modes based on the register activity, thereby achieving significant power reduction. To meet design constraints of different applications, we present four schemes to implement the proposed design, providing design flexibility. Additionally, with device selection and worst case sizing methodology, we mitigate aging-effect-induced RF reliability degradation. Simulation results on SPEC 2000 benchmarks demonstrate that TM-RF achieves up to 81.4% power savings and 17% reliability improvement on average, with minimal impact on performance.
Keywords :
flip-flops; microprocessor chips; pipeline processing; power aware computing; RF designers; TM-RF; aging-aware power-efficient register file design; aging-aware trimodal register file design; aging-effect-induced RF reliability degradation; bias temperature instability; device selection; instruction level parallelism; modern microprocessors; power consumption; power efficiency; power reduction; register activity; worst case sizing methodology; Aging; Leakage currents; Microprocessors; Power demand; Radio frequency; Registers; Reliability; Leakage current; bias temperature instability (NBTI/PBTI); low power; process variation; register file (RF);
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2014.2334136