DocumentCode
1111837
Title
GaAs/(GaAl)As heterojunction bipolar transistors using a self-aligned substitutional emitter process
Author
Chang, M.F. ; Asbeck, Peter M. ; Miller, D.L. ; Wang, K.C.
Author_Institution
Rockwell International Corporation, Thousand Oaks, CA
Volume
7
Issue
1
fYear
1986
fDate
1/1/1986 12:00:00 AM
Firstpage
8
Lastpage
10
Abstract
This paper describes the first self-aligned heterojunction bipolar transistor (HBT) process which includes ion implantation to reduce the base resistance. With this substitutional emitter technique, the base implant and the emitter contact patterns are defined with the same mask. Arbitrary contact materials can be used allowing optimization of the contact resistances. Transistors with emitter width down to 1.5 µm have been fabricated. Nonthreshold logic (NTL) ring oscillators made with these transistors had propagation delay times down to 27.2 ps. This is the lowest reported to date for bipolar transistors.
Keywords
Annealing; Contact resistance; Electrical resistance measurement; Etching; Gallium arsenide; Heterojunction bipolar transistors; Implants; Plasma applications; Plasma immersion ion implantation; Resists;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1986.26274
Filename
1486097
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