DocumentCode :
1111837
Title :
GaAs/(GaAl)As heterojunction bipolar transistors using a self-aligned substitutional emitter process
Author :
Chang, M.F. ; Asbeck, Peter M. ; Miller, D.L. ; Wang, K.C.
Author_Institution :
Rockwell International Corporation, Thousand Oaks, CA
Volume :
7
Issue :
1
fYear :
1986
fDate :
1/1/1986 12:00:00 AM
Firstpage :
8
Lastpage :
10
Abstract :
This paper describes the first self-aligned heterojunction bipolar transistor (HBT) process which includes ion implantation to reduce the base resistance. With this substitutional emitter technique, the base implant and the emitter contact patterns are defined with the same mask. Arbitrary contact materials can be used allowing optimization of the contact resistances. Transistors with emitter width down to 1.5 µm have been fabricated. Nonthreshold logic (NTL) ring oscillators made with these transistors had propagation delay times down to 27.2 ps. This is the lowest reported to date for bipolar transistors.
Keywords :
Annealing; Contact resistance; Electrical resistance measurement; Etching; Gallium arsenide; Heterojunction bipolar transistors; Implants; Plasma applications; Plasma immersion ion implantation; Resists;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26274
Filename :
1486097
Link To Document :
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