• DocumentCode
    1111837
  • Title

    GaAs/(GaAl)As heterojunction bipolar transistors using a self-aligned substitutional emitter process

  • Author

    Chang, M.F. ; Asbeck, Peter M. ; Miller, D.L. ; Wang, K.C.

  • Author_Institution
    Rockwell International Corporation, Thousand Oaks, CA
  • Volume
    7
  • Issue
    1
  • fYear
    1986
  • fDate
    1/1/1986 12:00:00 AM
  • Firstpage
    8
  • Lastpage
    10
  • Abstract
    This paper describes the first self-aligned heterojunction bipolar transistor (HBT) process which includes ion implantation to reduce the base resistance. With this substitutional emitter technique, the base implant and the emitter contact patterns are defined with the same mask. Arbitrary contact materials can be used allowing optimization of the contact resistances. Transistors with emitter width down to 1.5 µm have been fabricated. Nonthreshold logic (NTL) ring oscillators made with these transistors had propagation delay times down to 27.2 ps. This is the lowest reported to date for bipolar transistors.
  • Keywords
    Annealing; Contact resistance; Electrical resistance measurement; Etching; Gallium arsenide; Heterojunction bipolar transistors; Implants; Plasma applications; Plasma immersion ion implantation; Resists;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1986.26274
  • Filename
    1486097